线上研讨会-用于电子器件和集成电路检测的锁相红外成像技术

用于电子器件和集成电路缺陷检测的Lock-in Thermography锁相红外成像技术

红外热像检测是电子器件和组件的故障探查和品管的既定测试程序 - 从原型开发阶段到批量生产。您想了解更多吗？敬请加入免费的InfraTec在线研讨会

会议语言： 英语

时间：2022年6月9日 ，16：00-18：00 （北京时间）

组织方：InfraTec GmbH Infrarotsensorik und Messtechnik

会议内容：

- 故障分析和缺陷检测

- 质量和过程控制

- 灵活的研发方案

- 从基础配置到整体解决方案

- PCB板、集成电路、半导体材料和多芯片模块上的热点检测

- 检测散热器的故障热连接、短路、焊接缺陷和引线键合错误

热成像实践技术讲座“热成像在微电子学中的挑战与应用”

演讲人Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG

线上会议信息： https://www.infratec.eu/company/training-appointments/

infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits

The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. You would like to know more? Then join the free InfraTec online event.

• Failure analysis and defect inspection

• Quality and process control

• Flexible R&D solution

• Basic configuration to turnkey solution

• Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules

•     Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors

Technical Lecture from Thermography Practice

https://www.infratec.eu/company/training-appointments/