用于电子器件和集成电路缺陷检测的Lock-in Thermography锁相红外成像技术 红外热像检测是电子器件和组件的故障探查和品管的既定测试程序 - 从原型开发阶段到批量生产。您想了解更多吗?敬请加入免费的InfraTec在线研讨会 会议语言: 英语 时间:2022年6月9日 ,16:00-18:00 (北京时间) 组织方:InfraTec GmbH Infrarotsensorik und Messtechnik 会议内容: - 故障分析和缺陷检测 - 质量和过程控制 - 灵活的研发方案 - 从基础配置到整体解决方案 - PCB板、集成电路、半导体材料和多芯片模块上的热点检测 - 检测散热器的故障热连接、短路、焊接缺陷和引线键合错误 热成像实践技术讲座“热成像在微电子学中的挑战与应用” 演讲人Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG 线上会议信息: https://www.infratec.eu/company/training-appointments/ infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. You would like to know more? Then join the free InfraTec online event. Failure analysis and defect inspection Quality and process control Flexible R&D solution Basic configuration to turnkey solution Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors Technical Lecture from Thermography Practice https://www.infratec.eu/company/training-appointments/
2022年05月20日
线上研讨会-用于电子器件和集成电路检测的锁相红外成像技术
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