用于电子器件和集成电路缺陷检测的Lock-in Thermography锁相红外成像技术

红外热像检测是电子器件和组件的故障探查和品管的既定测试程序 - 从原型开发阶段到批量生产。您想了解更多吗?敬请加入免费的InfraTec在线研讨会

 

会议语言: 英语

时间:2022年6月9日 ,16:00-18:00 (北京时间)

组织方:InfraTec GmbH Infrarotsensorik und Messtechnik

会议内容:

- 故障分析和缺陷检测

- 质量和过程控制

- 灵活的研发方案

- 从基础配置到整体解决方案

- PCB板、集成电路、半导体材料和多芯片模块上的热点检测

- 检测散热器的故障热连接、短路、焊接缺陷和引线键合错误

 

热成像实践技术讲座“热成像在微电子学中的挑战与应用”

 

演讲人Speaker: Marko Hoffmann, Infineon Technologies Dresden GmbH & Co. KG

线上会议信息: https://www.infratec.eu/company/training-appointments/


infrared Lock-in Thermography for Inspection of Electronics and Integrated Circuits

The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. You would like to know more? Then join the free InfraTec online event.

  • Failure analysis and defect inspection

  • Quality and process control

  • Flexible R&D solution

  • Basic configuration to turnkey solution

  • Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules

  •     Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors

Technical Lecture from Thermography Practice

https://www.infratec.eu/company/training-appointments/

2022年05月20日

线上会议-微米级红外显微热成像测温 Online Event -Micro-Thermography Contactless Temperature Measurement in the Micrometer Scale

线上研讨会-用于电子器件和集成电路检测的锁相红外成像技术

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