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主动激励式红外成像(Active Thermography) 用于非破坏性材料缺陷检测
主动式红外成像无损检测技术(Active Thermography)是基于预先在被测物体(试件)施加热某种激励源使隐藏的缺陷显露出来的方法,根据被测物体材质、结构和缺陷类型等特定检测条件,选取不同热激励方式(高能脉冲闪光灯、超声波、电磁、热风等)并用计算机控制进行周期、脉冲等函数形式的加热,同时采用InfraTec(英福泰克)的红外热像仪记录红外热图数据,通过专门的热图像分析软件进行图像信号处理和分析并最终显示检测结果。
넶27 2015-07-20 -
Thermal Stress Analysis of Metals InfraTec High‐End‐Thermography with ImageIR® 8300
Summary
Lock‐In thermography is suitable for qualitative stress measurement both for the elastic stress range and for the transition to the plastic stress range. Using suitable formulas for the relationship of the temperature change to the
stress change within the material quantitative results can certainly be calculated. Particularly in the case of poor heat conductors such as steel inhomogeneity within the material such as surface corrosion with considerable penetration
depth and the associate넶21 2020-02-05